ThisMicrowaves & RFarticle is reprinted here with permission.
The Overview
希望帮助制造商射频天线模块和designers of mobile devices—in saving space on printed-circuit boards while optimizing high-speed 5G components,Molex'snew Flex-to-Board RF mmWave Connector 5G25 series of interconnects supports high-speed data transfers in a compact footprint.
Who Needs It And Why
Let’s say you’re designing an RF antenna module, or, even better, the main board in a new mobile device on which that module will reside. Space is at a premium, but so is high-speed connectivity and support for 5G, which, for the foreseeable future, mobile devices must possess. According to Molex’s recent global survey,移动设备的未来, 82% of respondents expect consumers will see substantial benefits from their mobile devices within five years. Further, respondents ranked mmWave 5G as the leading disruptive technology in smart mobile devices. Thus, Molex’s 5G25 series of interconnects could be among the elements that make that next-generation mobile flagship happen.
Under the Hood
The MolexFlex-to-Board RF Connector 5G25 series在非常小的互连中支持高达25 GHz的高速数据传输,该互连可提供额外的保护,以防止恶劣的环境条件。信号螺距为0.35毫米,交配的身体高度仅为0.6毫米,短体宽度为2.5毫米,长度为3.6毫米,紧凑型连接器增加了PCB设计师的灵活性。此外,5G25使RF天线模块和移动设备的设计人员能够组合RF和非RF信号,从而减少了对额外连接器的需求,同时可以节省额外的空间和成本。
The 5G25 features full electromagnetic-interference (EMI) shielding, encompassing both RF terminal and full connector shielding to ensure superior signal integrity. By employing a center shield-in contact with receptacle and plug, each row can be isolated to boost overall signal-integrity stability. Additionally, Molex’s fully-shielded design delivers excellent far-field gain performance, which is ideal for connecting 5G antennas to the rest of the transceiver.
The Molex Flex-to-Board RF Connector 5G25 series facilitates fast, trouble-free assembly with excellent “click feeling” to prevent faulty mating. Additionally, the ultra-compact connectors feature robust peel force to increase reliability and minimize the load on assembly operators or automatic assembly machines.